IBM Power 11 Features & Upgrades
Processor modules, DDR5 memory kits, NVMe storage, expansion drawers, PCIe adapters, and the HMC console that make up an IBM Power 11 configuration, with model compatibility noted for each.
Power 11 DCM Processor Modules
The Dual-Chip Module (DCM) processor option used across S1122, S1124, L1122, L1124, E1150, and E1180 for maximum core count and throughput.
Power 11 eSCM Processor Modules
The entry Single-Chip Module (eSCM) processor option used on S1112 and S1122 for cost-effective smaller-core configurations.
DDR5 DDIMM Memory Kits for Power 11
Differential DIMM (DDIMM) DDR5 memory modules used across every Power 11 model, scaling from 512 GB on the S1112 up to 64 TB total on the E1180.
NVMe U.2 Internal Storage for Power 11
Direct NVMe U.2 storage bays built into every Power11 chassis, scaling from 12.8 TB raw on the S1112 up to 244.8 TB raw on the S1124 and L1124.
NED24 NVMe Expansion Drawer
An external NVMe expansion drawer that extends direct-attached flash storage capacity beyond a Power 11 chassis's internal drive bays.
Gen4 PCIe I/O Expansion Drawer
A 12- or 24-slot PCIe expansion drawer that adds adapter capacity beyond a Power 11 chassis's direct PCIe slots for networking, SAN, and tape connectivity.
HMC 7063-CR2 Hardware Management Console
The required v11 Hardware Management Console appliance for every Power 11 server, available as the 7063-CR2 hardware appliance or the IBM vHMC software appliance.
PCIe Adapters for Power 11
Networking, SAN, and tape connectivity adapters across direct-chassis PCIe Gen4 slots, the I/O layer common to every current Power 11 model.