Power 11 DCM Processor Modules
The Dual-Chip Module (DCM) processor option used across S1122, S1124, L1122, L1124, E1150, and E1180 for maximum core count and throughput.
The Dual-Chip Module (DCM) is IBM's higher-core-count Power 11 processor packaging, pairing two processor chips per module to reach core counts from 16 up to 60 (and higher in multi-node E1150/E1180 configurations). DCM options appear across the S1122, S1124, L1122, L1124, E1150, and E1180.
Where DCM shows up across the Power 11 line
DCM feature codes by model
| Model | DCM Feature Codes | Core Range |
|---|---|---|
| S1122 | EBG8, EBG9, EBGA | 16-60 cores |
| S1124 | EP3X, EP3H, EP3Y | 16-60 cores |
| L1122 | ERGF, ERGG, ERGH | 16-60 cores |
| L1124 | EP4C, EP4B, EP4J | 16-60 cores |
| E1150 | EPEX, EPEY, EPEZ | 16-120 cores |
| E1180 | EDQ0, EDQ9, EDQD | 40-256 cores |
See each model's own listing for exact clock speeds and CPW/rPerf ratings per feature code -- DCM feature codes are model-specific even at the same core count.
Related
Power 11 eSCM Processor Modules
The entry Single-Chip Module (eSCM) processor option used on S1112 and S1122 for cost-effective smaller-core configurations.
DDR5 DDIMM Memory Kits for Power 11
Differential DIMM (DDIMM) DDR5 memory modules used across every Power 11 model, scaling from 512 GB on the S1112 up to 64 TB total on the E1180.
NVMe U.2 Internal Storage for Power 11
Direct NVMe U.2 storage bays built into every Power11 chassis, scaling from 12.8 TB raw on the S1112 up to 244.8 TB raw on the S1124 and L1124.
NED24 NVMe Expansion Drawer
An external NVMe expansion drawer that extends direct-attached flash storage capacity beyond a Power 11 chassis's internal drive bays.